Wafer Inspection
VEGA 320
Sustainable Innovation
OVERVIEW
OPTZ is the first innovative venture in the world to develop and manufacture color inspection-based wafer inspection and 3D measurement equipment.. OPTZ's VEGA320 provides a tool for measuring and analyzing the 2D surface inspection of wafers and the 3D height of post-process bumps throughout the semiconductor production process.
Main GUI
(Varify)
3D Height Map SPC
(Max, Min, Avg)
3D Height Co-p.Map
(Max-Min)
3D Height Histogram
3D Scan
(Bump Height)
FEATURES
- 2D & 3D INSPECTION
- COLOR INSPECTION WITH COLOR LINE SCAN CAMERA
- APPLY 2LIGHTING(REFLECTIVE & DIFFUSIVE) TO ULTRA-FAST CONVERSION
- ALGORITHMS TO MINIMIZE COLOR VARIATION IN SUBSTRUCTURE
- INCREASE PRODUCTIVITY WITH REAL TIME DEFECT GRABBING
- INSPECTABLE SUBSTRATE
- SOLDER BUMP (BALL, CU-PILLAR, C-4, MICRO PILLAR, RDL, FAN-OUT)
- GOLD BUMP
- EDS TEST(PROBE MARK, INK)
- PKG
- APPLICATION OF INSPECTION
- SILICON WAFER (8” , 12”)
- GLASS, STEEL, RING FRAME, CHIP TRAY
- PLP
SPECIFICATION
- 2D & 3D INSPECTION SPEC
- WAFER SIZE - 200 & 300MM
- BUMP TYPE - CU, SOLDER, SOLDER BALL, RDL, GOLD, NICKEL, SILVER, MICRO, C4, ETC..
- DIE SIZE RANGE - 0.4~30MM
- HANDLING - BARE WAFER(8& 12INCH), RING FRAME(OPTION)
- THICKNESS - 350~800㎛
- MAPPING - DOOR MAPPING
- 2D METROLOGY - CD MEASUREMENT (BUMP SIZE VIOLATION)
- 3D ACCURACY & REPEATABILITY - ≤1㎛ (BASE ON OPTZ STANDARD BLOCK)
- BUMP HEIGHT RANGE - 5~300㎛
- DETECTION RATE - ≥99% (≥2PIXEL)
