This equipment inspects various visual defects by inspecting the glass surface in the form of a glass panel or glass wafer where via holes necessary for connecting upper and lower IC elements are formed during the TGV package production process. It is an automatic optical inspection equipment that automatically selects defects that may occur during via filling (diameter, roundness, positional deviation of each via, via block, etc.) using a high-precision optical system for semiconductor measurement and a special hybrid backlight lighting system.